Nanium S.A.

NANIUM, S.A., Vila do Conde (Porto), Portugal, is an independent semiconductor packaging company, dedicated to providing development, manufacturing, testing and engineering services in the semiconductor business, operating namely in WLP/RDL and in customised System in Package.

NANIUM is focusing on leading edge advanced packaging technologies and intends to become a reference Backend foundry for WLP (Fan-Out WLP and Fan-In WLP) and SiP technologies in Europe.

Thanks to 14 years‟ experience in the Backend semiconductor business (as former Siemens Semiconductors, Infineon Technologies and recently Qimonda Portugal), NANIUM has a highly qualified and competent team and state-of-the-art facilities and equipment that include:

  • the ultimate technologies in wafer level packaging for 200mm (8”) and 300mm (12”);
  • complete assembly and test manufacturing solutions (covering assembly, test, burn-in, mark-scan-pack)



  • Bumping of 3D stacked sensors, namely adaption of UBM and balling process for the specific needs of 3D sensors (with open TSVs which are 200μm deep)
  • Development of 300mm FO-WLP technology for Power Electronics products and for 3D Integration
  • Extension of 300mm FO-WLP technology for embedding stacked products with Si interposer and active device
  • The ultimate technologies in wafer level packaging for 200mm (8”) and 300mm (12”)
  • Know-how and state-of-the-art infrastructure for 300mm FO-WLP technology development and volume manufacturing
  • Complete development cycle competences for advanced packaging from design, to material development; process development; prototype execution and testing and characterization

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Nanium S.A.